| 发明名称 | Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments | ||
| 摘要 | In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink. | ||
| 申请公布号 | US8921702(B1) | 申请公布日期 | 2014.12.30 |
| 申请号 | US201012691322 | 申请日期 | 2010.01.21 |
| 申请人 | HRL Laboratories, LLC | 发明人 | Carter William B.;Brewer Peter D.;Gross Adam F.;Rogers Jeffrey L.;Guinn Keith V.;Jacobsen Alan J. |
| 分类号 | H05K1/00 | 主分类号 | H05K1/00 |
| 代理机构 | Balzan Intellectual Property Law, PC | 代理人 | Balzan Intellectual Property Law, PC |
| 主权项 | 1. A thermal plane structure comprising: a) a non-wicking structural microtruss between opposing surfaces of a multilayer structure, the non-wicking structural microtruss being comprised of non-wicking microtruss struts; b) a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink; c) a microtruss wick located between the opposing surfaces and between the thermal source and the thermal sink; and d) the microtruss wick comprising an ordered three dimensional network of continuous interpenetrating truss members. | ||
| 地址 | Malibu CA US | ||