Methods and apparatus for package on package devices with reversed stud bump through via interconnections

摘要

Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed.

主权项

1. A package comprising:
a top integrated circuit coupled to a first redistribution layer (RDL); a bottom integrated circuit coupled to a second RDL; a pad extending from a surface of the first RDL and extending toward the second RDL, a surface of the bottom integrated circuit being coplanar with a surface of the pad; a reversed stud bump stack extending between the pad and the second RDL, the reversed stud bump stack comprising a plurality of individual stud bumps stacked one atop another, each of the plurality of individual stud bumps having a base region of a first width and a tail region of a second width, the first width being larger than the second width, the base region of each of the plurality of individual stud bumps being oriented to a first direction, wherein the first direction is towards either the first RDL or the second RDL; and a molding compound surrounding and in contact with the reversed stud bump from a top of the reversed stud bump stack to a bottom of the reversed stud bump stack.