Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material

摘要

To provide a resin composition having excellent thermal conductivity and excellent insulation reliability, a molded object, a substrate material, and a circuit board. [Solution] Provided is a resin composition which comprises an epoxy resin, a hardener, and an inorganic filler, wherein the epoxy resin and/or the hardener has a naphthalene structure, the inorganic filler comprises hexagonal boron nitride, and the inorganic filler accounts for 50-85 vol. % of the whole resin composition. Since a naphthalene structure, which imparts the satisfactory ability to wet the hexagonal boron nitride included in the inorganic filler, has been introduced into the epoxy resin and/or the hardener to heighten the inorganic-filler loading characteristics, this resin composition attains excellent heat dissipation properties, heat resistance, insulating properties, etc.

主权项

1. A resin composition comprising an epoxy resin, a curing agent and an inorganic filler, wherein: one or both of the epoxy resin and the curing agent contain a naphthalene structure; the inorganic filler contains hexagonal boron nitride; and the inorganic filler is contained in an amount of 50 to 85 vol % in the entire resin composition wherein the inorganic filler contains coarse particles having an average particle diameter of 10 to 400 μm and fine particles having an average particle diameter of 0.5 to 4.0 μm, and the blending ratio of the coarse particles is 70% or more.