| 摘要 |
[Document Namel :Abstract of Disclosure '-itie of Invention] 2onding Wire for High Speed Sighal [Onlect] To provide a bonding wire of an Ag -Pd -Au -based al. y for high speed signal lines/" which is free from a. rigid silver sulfide (2).12-,NS) film though. an unstable silver sulfide laybr might be forme& on a surface of the bending' wire, and. is capable of sending ultrahigh frequency signals of a stable band of several GHz or the like, [Solving Means] A ternary' alloy including 2.5 to 4.0 mass% of palladium (Pd) and 1.5 to 2.5 mass% of gold. (Au), with thC' balance being silver (P.g) having purity of 99.99 mass% Or More, Wherein a cross-section CL:: the bonding wire includes a. surface film and a tore material, the surface inciudes a continimulsly cast summace..'rhich. a diameter is reduced after continuous casting and a surface segregation layer, and the surface segregation. layer inclubes an. alic region. where a content of the silver (Ag) is gradually- increased and a content of the gbid (Au) is gradually reduced. as compared to the core material. [Selected DrawinJ. 1. |
