Semiconductor chip and semiconductor device including the same

摘要

A semiconductor chip includes: a data output buffer that outputs a data signal; a first power-supply pad that supplies a first power-supply potential to the data output buffer; a power-supply wiring that is connected to the first power-supply pad; a strobe output buffer that outputs a strobe signal; and a second power-supply pad that supplies a second power-supply potential to the strobe output buffer. The power-supply wiring and the second power-supply pad are electrically independent of each other. Therefore, the power-supply noise associated with the switching of the data output buffer does not spread to the strobe output buffer. Thus, it is possible to improve the quality of the strobe signal.

主权项

1. A semiconductor device comprising a semiconductor chip comprising:
a plurality of data output buffers outputting a data signal; a plurality of first power-supply pads supplied with a first power-supply potential; a first wiring connected between the first power-supply pads and the data output buffers in common; a strobe output buffer outputting a strobe signal for the data signal; a second power-supply pad provided independently of the first power-supply pads and supplied with a second power-supply potential; and a second wiring between the second power-supply pad and the strobe output buffer, the second wiring being electrically independent of the first wiring; wherein the first power-supply potential is substantially equal to the second power-supply potential.