发明名称 |
ALIGNMENT IN THE PACKAGING OF INTEGRATED CIRCUITS |
摘要 |
A method includes: arranging an upper package in a lower package by using an align mask in the lower package; and arranging the upper package on the lower package. The upper package is arranged in the lower package after the upper package is arranged on the lower package. After that, a reflow process is performed to bond the upper package to the lower package. |
申请公布号 |
KR20140147648(A) |
申请公布日期 |
2014.12.30 |
申请号 |
KR20130135438 |
申请日期 |
2013.11.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HUANG KUEI WEI;LIN CHIH WEI;LIN WEI HUNG;CHENG MING DA;LIU CHUNG SHI |
分类号 |
H01L23/18;H01L23/48 |
主分类号 |
H01L23/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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