Decoupling device and fabricating method thereof

摘要

A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.

主权项

1. A decoupling device, comprising:
a lead frame, comprising: a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion, wherein the two anode terminal portions are electrically connected with each other through a conductive line, and the lead frame has a first horizontal plane; a plurality of capacitor units, wherein the capacitor units are connected with each other in parallel and disposed on the lead frame, each of the capacitor units is provided with a cathode portion and an anode portion opposite to each other, the cathode portion of the capacitor unit is electrically connected with the cathode terminal portion, and the anode portion of the capacitor unit is electrically connected with the anode terminal portion, the plurality of the capacitor units are arrayed into a capacitor unit assembly in a manner of pieces as one group along a second horizontal plane which is parallel with the first horizontal plane; a protective layer, for wrapping at least one of the anode portion and the cathode portion of the capacitor unit entirely; and a packaging element, for covering the lead frame, the capacitor units and the protective layer, wherein the packaging element exposes a bottom surface of the lead frame.