Semiconductor device having mode of operation defined by inner bump assembly connection

摘要

Semiconductor devices are described that are configured to have a state of operation defined by a connection between at least one inner bump assembly and a selected outer bump assembly. In an implementation, the semiconductor device, which may be a wafer-level (chip-scale) package semiconductor device, includes an integrated circuit chip, a plurality of outer bump assemblies disposed on the chip, and one or more inner bump assemblies disposed on the chip so that the inner bump assemblies are at least partially surrounded by the outer bump assemblies. At least one of the inner bump assemblies is configured to be connected to a selected outer bump assembly to cause the integrated circuit chip to have a desired state of operation.

主权项

1. A method comprising:
in a semiconductor device including an integrated circuit chip, a selector circuit, a plurality of outer bump assemblies disposed on the integrated circuit chip, and at least one inner bump assembly disposed on the integrated circuit chip so that the at least one inner bump assembly is at least partially surrounded by the plurality of outer bump assemblies, detecting the connection of the at least one inner bump assembly to a selected one of the plurality of outer bump assemblies; and causing, via the selector circuit, the integrated circuit chip to operate in a first state of operation when the at least one inner bump assembly is connected to a first one of the outer bump assemblies and to cause the integrated circuit chip to operate in the second state of operation when the at least one inner bump assembly is connected to a second one of the outer bump assemblies.