发明名称 Providing a consolidated sideband communication channel between devices
摘要 In an embodiment, the present invention includes a protocol stack having a transaction layer and a link layer. In addition a first physical (PHY) unit is coupled to the protocol stack to provide communication between a processor and a device coupled to the processor via a physical link, where the first PHY unit is of a low power communication protocol and includes a first physical unit circuit. In turn, a second PHY unit is coupled to the protocol stack to provide communication between the processor and the device via a sideband channel coupled between the multicore processor and the device separate from the physical link, where the second PHY unit includes a second physical unit circuit. Other embodiments are described and claimed.
申请公布号 US8924620(B2) 申请公布日期 2014.12.30
申请号 US201314011009 申请日期 2013.08.27
申请人 Intel Corporation 发明人 Harriman David J.;Wagh Mahesh;Gough Robert E.;Jaussi James E.
分类号 G06F13/20;G06F13/40 主分类号 G06F13/20
代理机构 Trop, Pruner & Hu, P.C. 代理人 Trop, Pruner & Hu, P.C.
主权项 1. An apparatus comprising: a logic to operate a Peripheral Component Interconnect Express™ (PCIe™) based transaction layer and a link layer; a first physical (PHY) unit coupled to the logic to transmit and receive data via a physical link; and a second PHY unit coupled to the logic to transmit and receive data via a second physical link, the second PHY unit comprising a M-PHY electrical layer and a logical layer to interface the logic with the M-PHY electrical layer, the logical layer including a link training and status state machine (LTSSM) to perform link training of the second physical link and to support a multi-lane configuration of the second physical link.
地址 Santa Clara CA US