发明名称 |
Providing a consolidated sideband communication channel between devices |
摘要 |
In an embodiment, the present invention includes a protocol stack having a transaction layer and a link layer. In addition a first physical (PHY) unit is coupled to the protocol stack to provide communication between a processor and a device coupled to the processor via a physical link, where the first PHY unit is of a low power communication protocol and includes a first physical unit circuit. In turn, a second PHY unit is coupled to the protocol stack to provide communication between the processor and the device via a sideband channel coupled between the multicore processor and the device separate from the physical link, where the second PHY unit includes a second physical unit circuit. Other embodiments are described and claimed. |
申请公布号 |
US8924620(B2) |
申请公布日期 |
2014.12.30 |
申请号 |
US201314011009 |
申请日期 |
2013.08.27 |
申请人 |
Intel Corporation |
发明人 |
Harriman David J.;Wagh Mahesh;Gough Robert E.;Jaussi James E. |
分类号 |
G06F13/20;G06F13/40 |
主分类号 |
G06F13/20 |
代理机构 |
Trop, Pruner & Hu, P.C. |
代理人 |
Trop, Pruner & Hu, P.C. |
主权项 |
1. An apparatus comprising:
a logic to operate a Peripheral Component Interconnect Express™ (PCIe™) based transaction layer and a link layer; a first physical (PHY) unit coupled to the logic to transmit and receive data via a physical link; and a second PHY unit coupled to the logic to transmit and receive data via a second physical link, the second PHY unit comprising a M-PHY electrical layer and a logical layer to interface the logic with the M-PHY electrical layer, the logical layer including a link training and status state machine (LTSSM) to perform link training of the second physical link and to support a multi-lane configuration of the second physical link. |
地址 |
Santa Clara CA US |