发明名称 |
Disk drive spindle motor with wiring substrate having extension portion passing through opening in base |
摘要 |
A spindle motor includes a stationary unit, a rotary unit and a bearing mechanism. The stationary unit includes a base member, a stator including a plurality of coils and a wiring substrate electrically connected to the stator. The base member includes a tubular portion, a first accommodation portion, an opening portion, a plurality of coil accommodation portions, a second accommodation portion, and at least one through-hole. The wiring substrate includes an arc portion and an extension portion. A lead wire is led out from at least one of the coils and is connected to the arc portion by soldering within the through-hole. |
申请公布号 |
US8922945(B2) |
申请公布日期 |
2014.12.30 |
申请号 |
US201313767228 |
申请日期 |
2013.02.14 |
申请人 |
Nidec Corporation |
发明人 |
Saeki Shintaro;Yawata Atsushi;Sekii Yoichi;Tamaoka Takehito;Abe Hiroyuki |
分类号 |
G11B19/20;H02K5/22;H02K3/52 |
主分类号 |
G11B19/20 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A spindle motor, comprising:
a stationary unit; a rotary unit; and a bearing mechanism; wherein the stationary unit includes a base member, a stator including a plurality of coils, and a wiring substrate electrically connected to the stator; the base member includes a cylindrical tubular portion axially extending about a center axis, a substantially annular first accommodation portion arranged on an upper surface of the base member and depressed toward a lower surface of the base member so as to accommodate at least a portion of the stator, an opening portion arranged in the first accommodation portion to extend through the base member, a plurality of coil accommodation portions positioned in the first accommodation portion and arranged around the tubular portion in a circumferential direction, a second accommodation portion positioned in the first accommodation portion to extend in the circumferential direction and arranged to accommodate a portion of the wiring substrate, and at least one through-hole arranged in the second accommodation portion; the wiring substrate includes an arc portion arranged in the second accommodation portion and an extension portion arranged on the lower surface of the base member through the opening portion; and at least one lead wire is led out from at least one of the coils and soldered to the arc portion within the at least one through-hole. |
地址 |
Kyoto JP |