| 摘要 |
The present invention relates to a solder supplementing apparatus, which supplements solder when the solder is insufficiently or excessively applied to a substrate, and which includes a solder accommodating part, a head part, a first driving part, and a second driving part. The solder accommodating part accommodates solder. The head part includes: a needle member that applies solder accommodated in the solder accommodating part to a portion of a substrate to which solder is insufficiently applied, wherein an end part of the needle member contacts the substrate or the solder accommodated in the solder accommodating part; and a vibration generator which is coupled to an upper part of the needle member and generates vibration when the solder is applied to the portion of the substrate to remove solder attached to the needle member therefrom. The first driving part reciprocates the head part between the solder accommodating part and the substrate. The second driving part vertically moves the head part such that the needle member contacts the solder accommodated in the solder accommodating part or moves away therefrom, or the needle member contacts the substrate or moves away therefrom. |
