发明名称 Movable die component for a press device
摘要 A movable die component for a press device includes a plate body having a workpiece engagement surface configured to engage a workpiece formed by the press device. The plate body has a plurality of internal pockets completely enclosed by the plate body. Optionally, the plate body may be formed by an additive manufacturing process, such as by forming a plurality of direct metal laser sintering layers. The direct metal laser sintering layers may include a lower layer, a plurality of middle layers, and an upper layer with the internal pockets being provided in the middle layers, and with the lower layer covering a bottom of each internal pocket and the upper layer coving a top of each internal pocket.
申请公布号 US8919177(B2) 申请公布日期 2014.12.30
申请号 US201313800953 申请日期 2013.03.13
申请人 Tyco Electronics Corporation 发明人 Ciocirlan Bogdan Octav;Pawlikowski Gregory Thomas;Whitcomb Chris Edward;Engasser Edward Joseph;Campbell Craig Maurice
分类号 B21D5/02;B21D13/02;B30B15/02 主分类号 B21D5/02
代理机构 代理人
主权项 1. A movable die component for a press device, the die component comprising: a plate body having a workpiece engagement surface configured to engage a workpiece formed by the press device, the plate body having a plurality of internal pockets completely enclosed by the plate body, the plate body being formed by a plurality of layers built-up on each other and being integral to form a unitary plate body, wherein the layers comprise a lower layer, a plurality of middle layers, and an upper layer, the internal pockets being provided in the middle layers, the lower layer covering a bottom of each internal pocket, the upper layer covering a top of each internal pocket.
地址 Berwyn PA US