| 摘要 |
A device having low dielectric absorption includes a PCB, a component connection region which includes a first conductor layered on the upper surface of a component connection region and a second conductor layered on the lower surface of the component connection region, an opening part which surrounds the component connection region, a low leakage component which connects the component connection region and the PCB through the opening part, and a guard which includes a third conductor which at least practically surrounds the opening part on the upper surface of the PCB and a forth conductor which at least practically surrounds the opening part on the lower surface of the PCB. |
