Methods and apparatus for thermal based substrate processing with variable temperature capability

摘要

A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap.

主权项

1. Apparatus for processing a substrate, comprising:
a substrate support, comprising:
a body having a substrate-facing surface;an inner ring disposed about the body;an outer ring disposed about the inner ring, wherein a first opening is formed between the inner and outer rings;a first seal ring disposed above the first opening;a shadow ring disposed above the inner ring, the shadow ring extending inward from the outer ring, wherein a second opening is formed between the shadow ring and the outer ring;a second seal ring disposed above the second opening;a space at least partially defined by the body, the inner ring, the outer ring, the first seal ring, the second seal ring, and the shadow ring;a first gap defined between a processing surface of a substrate when present on the substrate support and a space-facing surface of the shadow ring; anda plurality of second gaps, one second gap defined between each of the first seal ring and the inner ring, the first seal ring and the outer ring, the second seal ring and the shadow ring, and the second seal ring and the outer ring;wherein the first gap and the plurality of second gaps are configured such that, when a substrate is disposed between the body and the shadow ring, a gas provided to the space flows out of the space through the first gap, andwherein the first gap is larger than each of the plurality of second gaps.