| 摘要 |
43 SEMICONDUCTOR Disclosed is a semiconductor device configured by encapsulating a semiconductor element, partially or entirely covered 5 with a polyimide, using an epoxy resin composition for encapsulating semiconductor device which contains an epoxy resin (A) , a phenol resin (B) , a curing accelerator (C) , an inorganic filler (D), and silane a coupling agent (E) represented by the formula (1): 10 (in the formula (1) each , of R , R 1 2 and R 3 represents a C1-4 hydrocarbon group, all of them may be the same or different from each other, and n represents an integer from 0 to 2), and/or a hydrolytic condensate thereof. FIG. 1 |
