Multi-diameter unplugged component hole(s) on a printed circuit board (PCB)

摘要

In at least one embodiment, a circuit board assembly that includes a printed circuit board is provided. The printed circuit board includes a top surface and a bottom surface for supporting at least one through-hole electrical component. The printed circuit board defines at least one component hole extending from the top surface to the bottom surface for receiving the at least one through-hole electrical component. The at least one component hole includes a first section having a first diameter and a second section having a second diameter. The first diameter is different from the second diameter. Each of the first and the second sections are configured to receive solder paste for forming a solder joint with the at least one through-hole electrical component.

主权项

1. A circuit board assembly comprising:
a printed circuit board including a top surface and a bottom surface for supporting at least one through-hole electrical component; and wherein the printed circuit board defines at least one component hole extending from the top surface to the bottom surface for receiving the at least one through-hole electrical component, the at least one component hole includes a first section having a first diameter and a second section having a second diameter, the first diameter being greater than the second diameter, the first section being positioned below the top surface of the printed circuit board and the second section being positioned above the bottom surface of the printed circuit board, each of the first and the second sections receiving solder paste to form a solder joint with the at least one through-hole electrical component, and the first section being arranged to be substantially filled with solder paste to allow the solder joint to be present in both the first section and the second section, and wherein the at least one through-hole electrical component extends through the first section and the second section, at least one pad for receiving a surface mount device (SMD), the at least one pad being positioned about the at least one component hole for receiving the solder paste, wherein the at least one component hole and the at least one pad are configured to receive solder in a single solder operation such that a first solder joint is formed for the at least one through hole electrical component and a second solder joint is formed for the at least one SMD.