Epoxy resin composition and semiconductor device

摘要

An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1):;wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

主权项

1. An epoxy resin composition for encapsulating a semiconductor chip comprising
(A) a crystalline biphenyl epoxy resin, (B) a phenol aralkyl resin having a biphenylene moiety represented by general formula (2): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is an integer of 0 to 4; b is an integer of 0 to 4; c is an integer of 0 to 3; and n is an average and is a number of 0 to 10, (C-1) an epoxidized polybutadiene compound in the amount of 0.1 wt % to 1.5 wt % both inclusive in the total epoxy resin composition, and (D) a fused spherical silica in the amount of 85 wt % to 95 wt % both inclusive in the total epoxy resin composition, and (E) a curing accelerator.