High voltage metal-oxide-semiconductor transistor device and method of fabricating the same

摘要

The present invention provides a high voltage metal-oxide-semiconductor transistor device including a substrate, a deep well, and a doped region. The substrate and the doped region have a first conductive type, and the substrate has at least one electric field concentration region. The deep well has a second conductive type different from the first conductive type. The deep well is disposed in the substrate, and the doped region is disposed in the deep well. The doping concentrations of the doped region and the deep well in the electric field have a first ratio, and the doping concentrations of the doped region and the deep well outside the electric field have a second ratio. The first ratio is greater than the second ratio.

主权项

1. A high voltage metal-oxide-semiconductor (HV MOS) transistor device, comprising:
a substrate, having a first conductive type, and the substrate having at least one electric field concentration region; a deep well, disposed in the substrate, and the deep well having a second conductive type different from the first conductive type; a first doped region, disposed in the deep well, wherein a doping concentration of the first doped region and a doping concentration of the deep well in the electric field concentration region has a first ratio, the doping concentration of the first doped region and the doping concentration of the deep well outside the electric field concentration region has a second ratio, and the first ratio is greater than the second ratio; a high voltage well, disposed in the deep well, and the high voltage well having the first conductive type; a second doped region, disposed in the deep well, and the second doped region having the second conductive type, wherein the first doped region is located between the second doped region and the high voltage well; a third doped region, disposed in the high voltage well, and the third doped region having the second conductive type, wherein the electric field concentration surrounds a part of the third doped region; a gate structure, disposed on the high voltage well between the first doped region and the third doped region; and a fourth doped region, disposed in the high voltage well, and the fourth doped region having the first conductive type.