Ultrafast heat/room temperature adhesive composition for bonding applications

摘要

The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.

主权项

1. A two-part curable composition comprising:
a. A first part comprising:
i. at least one (meth)acrylate monomer in an amount within the range of 20 to 60 weight %;ii. a first halogen-free elastomer in an amount within the range of about 10 to about 50 weight % comprising a styrene-butadiene-styrene block copolymer having a styrene content of about 37% to about 43% by weight of the copolymer;iii. an acid catalyst;iv. a free radical initiator; andv. a free radical stabilizer; and b. A second part comprising:
i. at least one (meth)acrylate monomer in an amount with in the range of about 30 to about 70 weight %;ii. a second halogen-free elastomer in an amount within the range of about 10 to 40 weight %;iii. a catalyst; andiv. a stabilizer or stabilizing said catalyst; wherein when said first part and said second part are combined together a curable composition is formed.