Wire bonder including a transducer, a bond head, and a mounting apparatus

摘要

Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

主权项

1. A wire bonder comprising:
an ultrasonic transducer configured to perform wire bonding; a bond head; and a mounting apparatus configured to mount the ultrasonic transducer to the bond head, the ultrasonic transducer being configured to be mechanically driven on a horizontal plane to form electrical interconnections between separate locations within a semiconductor package, the mounting apparatus comprising: a flexural structure that is configured to bend, wherein the ultrasonic transducer is mounted to the flexural structure; at least one actuator attached to the flexural structure, the at least one actuator being configured and operative to bend the flexural structure, thereby causing a displacement of the ultrasonic transducer on at least the horizontal plane; and a plurality of connectors configured to connect the mounting apparatus to the ultrasonic transducer, wherein the at least one actuator is attached to the flexural structure at a first end of the flexural structure and the ultrasonic transducer extends from a second end of the flexural structure, the second end of the flexural structure being on an opposite side of the flexural structure relative to the first end of the flexural structure.