SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The present invention provides a semiconductor device and a manufacturing method thereof which can improve durability by encapsulating a region around an interposer as well as a semiconductor die, and can improve the efficiency of a process by using a good quality interposer and a semiconductor die only. According to an embodiment of the present invention, the method for manufacturing a semiconductor device comprises the following steps of: preparing a plurality of interposers including a through silicon via, a first redistribution layer which is electrically connected to the though silicon via at the top of the through silicon via, and a dielectric layer protecting the through silicon via and the first redistribution layer; attaching the interposers to a carrier; bonding a semiconductor die to the first redistribution layer exposed at the top of the interposers; encapsulating the interposers and the semiconductor die with an encapsulant; removing the carrier, and grinding the bottom of the interposers to expose the through silicon via; forming a second redistribution layer which is electrically connected to the through silicon via exposed at the bottom of the interposers; and forming a solder bump which is electrically connected to the second redistribution layer.