Device for aligning and pre-fixing a wafer

摘要

A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

主权项

1. A process for aligning and prefixing a flat substrate on a carrier substrate, said processing comprising the steps of:
position controlled aligning an outside contour of the flat substrate relative to an outside contour of the carrier substrate by engaging the outside contour of the flat substrate and/or the outside contour of the carrier substrate by at least one actuator having a single actuator arm, wherein the single actuator arm of the at least one actuator is oriented toward a center of the carrier substrate and the single actuator arm of the at least one actuator moves the flat substrate and/or the carrier substrate along a plane parallel to a contact surface of the flat substrate, and at least partially prefixing the contact surface of the aligned flat substrate onto the carrier substrate by attaching means.