| 摘要 |
The present invention relates to a semiconductor light emitting device including a plate, a semiconductor light emitting device chip, an encapsulating unit, and an optical plate. The plate includes an insulating unit, first and second conducting units which are electrically insulated by the insulating unit, an upper surface, and a lower surface which faces the upper surface, and whose insulating unit is connected from the upper surface to the lower surface. The semiconductor light emitting device chip includes a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity which is different from the first conductivity, an active layer which is interposed between the first and second semiconductor layers and generates a light by recombining an electron and a positive hole, a first electrode which is electrically connected to the first semiconductor layer, and a second electrode which is electrically connected to the second semiconductor layer, and is connected to the upper surface of the plate. The encapsulating unit is formed to cover the semiconductor light emitting device chip on the upper surface of the plate. The optical plate includes a plurality of micro lens formed on the upper surface and is fixed to the upper surface of the encapsulating unit. |
