Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements

摘要

A method for producing a composite material, associated composite material and associated semiconductor circuit arrangements is disclosed. A plurality of first electrically conducting material particles are applied to a carrier substrate and a second electrically conducting material is galvanically deposited on a surface of the first material particles in such a way that the second material mechanically and electrically bonds the plurality of first material particles to one another.

主权项

1. A semiconductor chip comprising:
a semiconductor substrate; an insulating layer disposed over the semiconductor substrate; an opening formed in the insulating layer, wherein the opening has a depth greater than 100 micrometers; a composite material disposed in the opening, the composite material comprising:
first electrically conducting material particles; anda second electrically conducting material; and a semiconductor device disposed in the semiconductor substrate, the semiconductor device electrically connected to the composite material.