MEMS device and manufacturing method thereof

摘要

A MEMS device includes: a movable element supported by a supporting member on a substrate; an encapsulation structure provided above the substrate so as to encapsulate the movable element; and a fin that is made of an insulation film, provided above the substrate, and provided inside of the encapsulation structure and outside of the movable element, and a part of the fin being positioned between a height from the substrate when the movable element are turned ON and a height from the substrate when the movable element are turned OFF.

主权项

1. A MEMS device comprising:
a movable element supported by a supporting member on a substrate; an encapsulation structure provided above the substrate so as to encapsulate the movable element; and a fin that is made of a first insulation film, provided above the substrate, and provided inside of the encapsulation structure and outside of the movable element, and a part of the fin being positioned between a height from the substrate when the movable element is turned ON and a height from the substrate when the movable element is turned OFF, wherein a region between the movable element and the encapsulation structure has a hollow structure, the encapsulation structure includes a second insulation film with through-hole and an over-sealing layer prepared on the second insulation film and the fin is provided outside of the movable element, is not in contact with the movable element, and does not extend over the movable element in a direction parallel to an upper horizontal surface of the substrate.