A SEMICONDUCTOR PACKAGE

摘要

A semiconductor package according to an embodiment of the present invention includes: a lower package which includes a lower semiconductor chip mounted on a lower package substrate; an upper package which is stacked on the lower package and includes an upper semiconductor chip mounted on an upper package substrate which includes a center part adjacent to the lower semiconductor chip and an edge part; and a thermal boundary material which is filled between the lower package and the upper package to allow the upper package substrate to touch the upper surface of the lower semiconductor chip. The upper package substrate includes a thermal diffusion via which penetrates the center part of the upper package substrate and a connection via which is separated from the thermal diffusion via and penetrates the edge part of the upper package substrate.