| 摘要 |
<p>The present invention relates to a test circuit of a semiconductor device and a method thereof. According to the embodiment of the present invention, provided is the semiconductor device which includes a first die and a second die which are connected through a through silicon via (TSV) and a test circuit part which measures the resistance of the TSV by controlling an amount of currents flowing in the TSV. Thereby, the present invention accurately measures the resistance of the TSV.</p> |
