| 摘要 |
<p>The present invention relates to a printed circuit board. The printed circuit board according to the present invention includes a first insulation layer, a pad which is formed on the first insulation layer, a second insulation layer which is deployed on the first insulation layer on which the pad is formed, and a via hole which is formed on the second insulation layer. The via hole formed on the second insulation layer comprises an irregular surface with an uneven shape on the bottom of the pad.</p> |
