APPARATUS MANUFACTURING CURVED SUBSTRATE USING LASER

摘要

The present invention relates to a curved substrate processing apparatus using laser, including a substrate supporting unit, a laser head unit, a first transfer unit, a second transfer unit, and a rotation adjustment unit. The substrate supporting unit supports a curved substrate having predetermined curvature in a horizontal direction. The laser head unit radiates a laser beam to the curved substrate supported by the substrate supporting unit. The first transfer unit transfers the laser head unit in the horizontal direction along a plurality of regions of the curved substrate divided corresponding to a working region of the laser head unit. The second transfer unit transfers the laser head unit in a vertical direction to enable the laser head unit to become close to or far from the curved substrate in order to make the distance between the laser head unit and the curved substrate be equal to the focal distance of the laser beam. The rotation adjustment unit adjusts a rotary angle of the laser head unit around a rotary shaft disposed parallel to the curved substrate as a center of rotation to enable the laser beam to be radiated perpendicular to the curved substrate in accordance with a position on the curved substrate to which the laser beam is radiated.