METHOD FOR MANUFACTURING FLEXIBLE SUBSTRATE WITH BURIED CONDUCTING TRACE USING MODIFICATION LAYER AND FLEXIBLE SUBSTRATE MANUFACTURED THEREBY

摘要

The present invention provides a method for manufacturing a flexible substrate with a buried conducting trace using a modification layer, capable of fundamentally removing problems such as environment pollution, remaining foreign materials, the reduction of an electrical characteristic, and the reduction of a processing speed due to the use of an existing buffer layer by using the existing buffer layer (modification layer in case of the present invention) without removal. The method for manufacturing the flexible substrate with the buried conducting trace using the modification layer includes the steps of: forming the modification layer made of metal, conductive polymers, or carbon materials on a substrate; forming the conducting trace on the modification layer; forming a polymer film by coating and curing the polymer on the modification layer by including the conducting trace; removing the substrate from the polymer film by applying a physical force; and converting the modification layer into a transparent electrode by oxidization or reduction by emitting particles with charges to the modification layer exposed by removing the substrate.