发明名称 |
PACKAGING MATERIAL FOR MOLDING |
摘要 |
A packaging material for molding controls the separation of a heat-resistant resin layer and comprises: a heat-resistant resin layer which is an outer layer; a metal foil layer; and a first adhesive layer formed between the heat-resistant resin layer and the metal foil layer. The first adhesive layer is composed of adhesive including a polyester resin and a two-component curable polyester urethane resin by a multifunctional isocyanate compound. The polyester resin uses dicarboxylic acid and dialcohol as raw materials. The dicarboxylic acid includes aliphatic carboxylic acid and aromatic carboxylic acid where the methylene number of a methylene chain is an even number. The content of the aromatic carboxylic acid is 40-80 mol% based on the total amount of dicarboxylic acid. The number-average molecular weight (Mn) of the polyester resin is 8000-25000, the weight-average molecular weight (Mw) is 15000-50000, and the ratio (Mw/Mn) is 1.3 to 2.5. |
申请公布号 |
KR20140146537(A) |
申请公布日期 |
2014.12.26 |
申请号 |
KR20140071381 |
申请日期 |
2014.06.12 |
申请人 |
SHOWA DENKO PACKAGING CO. |
发明人 |
ZENG KAIBIN;TAKADA SUSUMU |
分类号 |
B65D65/40;B32B27/06;H01M2/02 |
主分类号 |
B65D65/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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