PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

摘要

A package substrate includes an outermost interlayer resin insulation layer, an outermost conductive layer formed on a first surface of the outermost interlayer resin insulation layer and including first pads positioned to mount a first electronic component and second pads positioned to mount a second electronic component, a first conductive layer including first conductive circuits and formed on a second surface of the outermost interlayer resin insulation layer on the opposite side with respect to the first surface, first via conductors penetrating through the outermost interlayer resin insulation layer such that the first via conductors are connecting the first conductive layer and the first pads, and second via conductors penetrating through the outermost interlayer resin insulation layer such that the second via conductors are connecting the first conductive layer and the second pads. The first conductive circuits in the first conductive layer are connecting the first and second pads, respectively.

主权项

1. A package substrate, comprising:
an outermost interlayer resin insulation layer; an outermost conductive layer formed on a first surface of the outermost interlayer resin insulation layer and including a plurality of first pads positioned to mount a first electronic component and a plurality of second pads positioned to mount a second electronic component; a first conductive layer including a plurality of first conductive circuits and formed on a second surface of the outermost interlayer resin insulation layer on an opposite side with respect to the first surface; a plurality of first via conductors penetrating through the outermost interlayer resin insulation layer such that the first via conductors are connecting the first conductive layer and the first pads; and a plurality of second via conductors penetrating through the outermost interlayer resin insulation layer such that the second via conductors are connecting the first conductive layer and the second pads, wherein the first conductive circuits in the first conductive layer are connecting the first pads and the second pads, respectively.