发明名称 METAL-PLATED LAMINATED BOARD, AND PRINTED WIRING BOARD
摘要 A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.
申请公布号 US2014374142(A1) 申请公布日期 2014.12.25
申请号 US201214364914 申请日期 2012.11.29
申请人 PANASONIC CORPORATION 发明人 Inoue Hiroharu;Kishino Koji
分类号 H05K1/03;H05K3/02;H05K1/00 主分类号 H05K1/03
代理机构 代理人
主权项 1. A metal-clad laminate comprising: an insulating layer, and a metal layer present on at least one surface side of the insulating layer, wherein the insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer, the center layer contains a cured product of a resin composition, and a fiber base material, the first resin layer and the second resin layer are formed of cured products of resin compositions, respectively, the resin composition in the center layer contains a thermosetting resin, a resin contained in the resin composition in the center layer is different from resins contained in the resin compositions in the first resin layer and the second resin layer, and a coefficient of thermal expansion of the cured product of the resin composition contained in the first resin layer and a coefficient of thermal expansion of the cured product of the resin composition contained in the second resin layer are respectively smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.
地址 Osaka JP