发明名称 |
METAL-PLATED LAMINATED BOARD, AND PRINTED WIRING BOARD |
摘要 |
A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer. |
申请公布号 |
US2014374142(A1) |
申请公布日期 |
2014.12.25 |
申请号 |
US201214364914 |
申请日期 |
2012.11.29 |
申请人 |
PANASONIC CORPORATION |
发明人 |
Inoue Hiroharu;Kishino Koji |
分类号 |
H05K1/03;H05K3/02;H05K1/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
1. A metal-clad laminate comprising:
an insulating layer, and a metal layer present on at least one surface side of the insulating layer, wherein the insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer, the center layer contains a cured product of a resin composition, and a fiber base material, the first resin layer and the second resin layer are formed of cured products of resin compositions, respectively, the resin composition in the center layer contains a thermosetting resin, a resin contained in the resin composition in the center layer is different from resins contained in the resin compositions in the first resin layer and the second resin layer, and a coefficient of thermal expansion of the cured product of the resin composition contained in the first resin layer and a coefficient of thermal expansion of the cured product of the resin composition contained in the second resin layer are respectively smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer. |
地址 |
Osaka JP |