FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE STRUCTURE

摘要

A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.

主权项

1. A method for fabricating a conductive trace structure, comprising the steps:
forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region separated from the plating region by the exposed non-conductive substrate, the plating region being divided into at least two trace-forming portions and at least one bridge portion interconnecting the trace-forming portions; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion of the first metal layer and the second metal layer formed on the bridge portion.