Thermally Conductive Dielectric Interface

摘要

A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.

主权项

1. A thermally conductive dielectric interface, comprising:
a base having first and second sides substantially parallel to a base plane, and exhibiting a compressive modulus of at least 105 Pa, said base comprising a first silicone polymer preparation; and an upcoat disposed at said first and second sides of said base, said upcoat exhibiting a compressive modulus of less than 104 Pa, and comprising a second silicone polymer preparation, wherein a thickness of said interface is defined along an axis perpendicular to said base plane and extends through said upcoat and said base, and said interface exhibiting a voltage breakdown value of at least 3 kV and a thermal conductivity of at least 0.5 W/m*K through said thickness.