| 摘要 |
PROBLEM TO BE SOLVED: To provide a resistance thin film element with copper conductor layer, excellent in environment resistance with a resistance value change rate controlled to be within a fixed value.SOLUTION: In the resistance thin film element with copper conductor layer including a resistive layer that an electric resistor and a copper conductor layer with a wiring forming the resistive layer and a circuit stacked onto a surface of the resistive layer, on at least a single face of an insulation base material, a thickness of the resistive layer is the following film thickness relative to a target resistance value change rate &Dgr;R in an environment resistance test: t≥α/&Dgr;R, where α is a coefficient corresponding to the type of a resistive layer and t is a film thickness [nm] of a resistive layer. |
