COMPOSITE MODULE

摘要

Provided is a technique capable of improving isolation characteristics between a plurality of signal paths through which RF signals pass, without using ground electrodes or the like. Wiring electrodes 10a and 20a through which RF signals do not pass simultaneously are formed so as to be adjacent to each other in a central region of a component mounting surface 2a of a circuit board 2, and wiring electrodes 11a and 21a through which RF signals pass simultaneously are formed so as to be distanced from transmission paths 10 and 20. Accordingly, the RF signals do not simultaneously pass through the transmission paths 10 and 20, which are disposed near each other, and thus there is no risk that the RF signal passing through one of the signal paths will interfere with the RF signal passing through the other signal path.

主权项

1. A composite module comprising a circuit board having a plurality of communication systems provided thereon, wherein the plurality of communication systems communicate using respective predetermined frequency bands,
wherein each of the communication systems includes a plurality of signal paths allowing RF signals to pass; and wiring electrodes forming signal paths not allowing the RF signals to pass simultaneously among the plurality of signal paths and provided respectively in at least two of the communication systems are formed together so as to be adjacent to each other in a predetermined region of the circuit board.