发明名称 ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component in which a metal layer is less likely to peel off from a substrate.SOLUTION: An electronic component 1a includes: a substrate 7 made of an insulating ceramic material; a ceramic layer 8 made of a ceramic material and diffusion-bonded to the substrate 7; a metal layer 9 which has a first main surface 91 and a second main surface 92 opposite to the first main surface 91 and is diffusion-bonded to the ceramic layer 8 on the first main surface 91 side; and a characteristic layer 10 which is diffusion-bonded to the second main surface 92 side of the metal layer 9 and is made of a ceramic material and whose resistance value varies with an ambient temperature or an applied voltage.
申请公布号 JP2014241395(A) 申请公布日期 2014.12.25
申请号 JP20140080964 申请日期 2014.04.10
申请人 MURATA MFG CO LTD 发明人 IKEDA HIROSHI;MIURA TADAMASA;FURUTO MASAHIRO
分类号 H01C7/04;H01C7/00 主分类号 H01C7/04
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