MIXED ANALOG AND DIGITAL INTEGRATED CIRCUITS

摘要

PROBLEM TO BE SOLVED: To provide techniques for fabricating analog and digital circuits on separate dies and stacking and integrating the dies within a single package to form a mixed-signal IC that provides many benefits.SOLUTION: The analog and digital circuits are implemented on two separate dies using different IC processes suitable for these different types of circuits. An analog die 130 and a digital die 120 are thereafter integrated (stacked) and encapsulated within the single package. Bonding pads 112 are provided to interconnect the dies and to connect the dies to external pins. The bonding pads are located and arranged in a manner to provide required connectivity while minimizing the amount of the die area required to implement the pads. In another aspect, the die-to-die connectivity is tested in conjunction with a serial bus interface.