| 摘要 |
PROBLEM TO BE SOLVED: To fix an article on a mount.SOLUTION: In a method for bonding a paper board and a thermoplastic resin film, the paper board and the thermoplastic resin film are bonded by that: the thermoplastic resin film is disposed on the paper board; a heating coil part using for high frequency heating is disposed at a thermoplastic resin film side; and high frequency is applied to the heating coil part. An adhesive layer consisting of the adhesive layer exhibiting adhesivity at normal temperature or a hot melt material is not disposed between the thermoplastic resin film and the paper board. Tension is applied to the thermoplastic resin film. A space exists between the paper board and the thermoplastic resin film. Bonding is achieved by that an auxiliary material is pressed to the thermoplastic resin film early and then the heating coil part is pressed when the heating coil part and the predetermined auxiliary material are pressed to the thermoplastic resin film. |
