ELECTRONIC DEVICE

摘要

In an electronic device, a one-side heat radiation element and a two-side heat radiation element are disposed on a surface of a substrate adjacent to a heat sink. The one-side heat radiation element has a rear-side covered conductive portion and a rear-surface molded portion on the rear-side covered conductive portion adjacent to the heat sink, and radiates heat to the substrate. A surface of a rear-side exposed conductive portion of the two-side heat radiation element adjacent to the heat sink is exposed and the two-side heat radiation element radiates heat to the substrate and the heat sink. The rear-surface molded portion controls a limit position of the one-side heat radiation element toward the heat sink due to deformation of the substrate. A heat radiation gel is filled in between the rear-side exposed conductive portion and the heat sink to radiate heat from the two-side heat radiation element toward the heat sink.

主权项

1. An electronic device comprising:
a heat sink having a heat receiving surface; a substrate having an opposed surface and being supported through a plurality of support portions such that the opposed surface is opposed to the heat receiving surface of the heat sink; a one-side heat radiation element being disposed on the opposed surface of the substrate and being configured to radiate heat to the substrate, the one-side heat radiation element being an electronic element and including:
a first chip;a first substrate-side conductive portion being disposed adjacent to the substrate than the first chip and being electrically connected to the substrate; anda rear-surface covered conductive portion being disposed further from the substrate than the first chip, being electrically connected to the substrate through a first conductive terminal, and having a surface being covered with a molded resin adjacent to the heat sink; a two-side heat radiation element being disposed on the opposed surface of the substrate and being configured to radiate heat to the substrate and the heat receiving surface of the heat sink, the two-side heat radiation element being an electronic element and including:
a second chip;a second substrate-side conductive portion being disposed adjacent to the substrate than the second chip and being electrically connected to the substrate;a rear-surface exposed conductive portion being disposed further from the substrate than the second chip, being electrically connected to the substrate through a second conductive terminal, and having a surface without being covered with the molded resin adjacent to the heat sink; and an electrically insulating and heat radiating material having heat conductivity and being filled at least in between the rear-surface exposed conductive portion of the two-side heat radiation element and the heat receiving surface of the heat sink.