Ceramic Electronic Component

摘要

A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 μm in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 μm to 10 μm. The content of a Si component is 11% by weight or more (preferably 40% by weight or less).

主权项

1. A ceramic electronic component comprising:
a ceramic body having opposed end portions; and outer electrodes each respectively covering one of the opposed end portions of the ceramic body, each outer electrode including:
an end-surface portion;a side-surface turnover portion; anda glass layer in contact with the ceramic body in a region within at least 5 μm in linear distance from a covering end portion of the side-surface turnover portion and extending in a direction toward the end-surface portion, and which contains, at least, Si, whereinan average thickness of the glass layer is 3 μm to 10 μm; anda content of the Si component in the glass layer is 11% by weight or more.