发明名称 POLYAMIDE RESIN COMPOSITION, RESIN MOLDING, AND METHOD OF PRODUCING RESIN MOLDING WITH PLATED LAYER
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition which enables a resin molding to be properly plated while keeping the mechanical strength of the resin molding.SOLUTION: A polyamide resin composition comprises 100 pts.wt. of a polyamide resin, 1-20 pts.wt. of a laser direct structuring additive and glass fibers with an average fiber diameter of 4.0-9.0 μm.
申请公布号 JP2014240454(A) 申请公布日期 2014.12.25
申请号 JP20130122810 申请日期 2013.06.11
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 TAKANO TAKATOMO;YAMADA RYUSUKE
分类号 C08L77/00;C08J7/00;C08K3/22;C08K3/40;C08K7/04;H05K1/03 主分类号 C08L77/00
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