发明名称 |
POLYAMIDE RESIN COMPOSITION, RESIN MOLDING, AND METHOD OF PRODUCING RESIN MOLDING WITH PLATED LAYER |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition which enables a resin molding to be properly plated while keeping the mechanical strength of the resin molding.SOLUTION: A polyamide resin composition comprises 100 pts.wt. of a polyamide resin, 1-20 pts.wt. of a laser direct structuring additive and glass fibers with an average fiber diameter of 4.0-9.0 μm. |
申请公布号 |
JP2014240454(A) |
申请公布日期 |
2014.12.25 |
申请号 |
JP20130122810 |
申请日期 |
2013.06.11 |
申请人 |
MITSUBISHI ENGINEERING PLASTICS CORP |
发明人 |
TAKANO TAKATOMO;YAMADA RYUSUKE |
分类号 |
C08L77/00;C08J7/00;C08K3/22;C08K3/40;C08K7/04;H05K1/03 |
主分类号 |
C08L77/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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