发明名称 METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE
摘要 A method for manufacturing a nonvolatile semiconductor storage device according to an embodiment includes laminating a first wire extending in a first direction, and a film made into a variable resistance element made of a metallic material, which are laminated in order on a semiconductor substrate, dividing, into a plurality of pieces, the film made into the variable resistance element, in the first direction and a second direction, forming an interlayer insulating film between the plurality of pieces formed by dividing the film made into the variable resistance element in the second direction, and oxidizing the metallic material of the film made into the variable resistance element, and laminating an upper electrode and a second wire extending in the second direction, which are laminated in order on the film made into the variable resistance element and the interlayer insulating film.
申请公布号 US2014377932(A1) 申请公布日期 2014.12.25
申请号 US201414482893 申请日期 2014.09.10
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 TANAKA Toshiharu
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项 1. A method for manufacturing a nonvolatile semiconductor storage device, comprising: laminating a first wire extending in a first direction, a film made into a first non-ohmic element, and a film made into a first variable resistance element made of a metallic material, which are laminated in order on a semiconductor substrate extending in the first direction and a second direction intersecting the first direction; dividing, into a plurality of pieces, the film made into the first variable resistance element and the film made into the first non-ohmic element, in the first direction and the second direction; forming a first interlayer insulating film between the plurality of pieces formed by dividing the film made into the first variable resistance element and the film made into the first non-ohmic element in the first direction and the second direction; planarizing an upper surface of the first interlayer insulating film and the film made into the first variable resistance element; oxidizing the metallic material of the film made into the first variable resistance element; and laminating a first upper electrode extending in the second direction and a second wire extending in the second direction, which are laminated in order on the film made into the first variable resistance element and the first interlayer insulating film.
地址 Minato-ku JP