发明名称 METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES AND RELATED SEMICONDUCTOR DEVICES AND STRUCTURES
摘要 Methods of forming semiconductor devices, memory cells, and arrays of memory cells include forming a liner on a conductive material and exposing the liner to a radical oxidation process to densify the liner. The densified liner may protect the conductive material from substantial degradation or damage during a subsequent patterning process. A semiconductor device structure, according to embodiments of the disclosure, includes features extending from a substrate and spaced by a trench exposing a portion of a substrate. A liner is disposed on sidewalls of a region of at least one conductive material in each feature. A semiconductor device, according to embodiments of the disclosure, includes memory cells, each comprising a control gate region and a capping region with substantially aligning sidewalls and a charge structure under the control region.
申请公布号 US2014374811(A1) 申请公布日期 2014.12.25
申请号 US201313921509 申请日期 2013.06.19
申请人 Micron Technology, Inc. 发明人 Larsen Christopher J.;Daycock David A.;Shrotri Kunal
分类号 H01L21/308;H01L27/115;H01L29/423;H01L21/28 主分类号 H01L21/308
代理机构 代理人
主权项 1. A method of fanning a semiconductor device structure, the method comprising: forming a liner on a conductive material on a base material; exposing the liner to a radical oxidation treatment to form a densified liner on the conductive material; and patterning the base material while protecting the conductive material from patterning with the densified liner.
地址 Boise ID US