发明名称 |
Structure of a Trench MOS Rectifier and Method of Forming the Same |
摘要 |
A structure of trench MOS rectifier and a method of forming the same are disclosed including a plurality of trenches formed in the n− drift epitaxial layer, a plurality of MOS structure formed on the substrate either in discrete islands or in rows. Asides the MOS gates there are source regions formed under the mesas. A top metal served as an anode is then formed on the resulted front surface connecting the MOS gates and the adjacent source regions. |
申请公布号 |
US2014374790(A1) |
申请公布日期 |
2014.12.25 |
申请号 |
US201414215224 |
申请日期 |
2014.03.17 |
申请人 |
Chip Integration Tech.Co., Ltd. |
发明人 |
JIN QINHAI |
分类号 |
H01L29/747 |
主分类号 |
H01L29/747 |
代理机构 |
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代理人 |
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主权项 |
1. A trench rectifier device, comprising:
an n type lightly doped epitaxial layer on a heavily doped n type semiconductor substrate having a plurality of trenches formed in parallel therein and said trenches having a trench oxide layer formed on a bottom and sidewalls of said trenches; a first conductive poly-Si layer filled said trenches; a plurality of MOS gates having a stack of a second conductive poly-Si layer/a planar gate oxide layer formed on mesas in between said trenches; a plurality of source regions formed in said mesas; and a top metal layer formed over said MOS gates and said source regions. |
地址 |
Zhubei City TW |