发明名称 Structure of a Trench MOS Rectifier and Method of Forming the Same
摘要 A structure of trench MOS rectifier and a method of forming the same are disclosed including a plurality of trenches formed in the n− drift epitaxial layer, a plurality of MOS structure formed on the substrate either in discrete islands or in rows. Asides the MOS gates there are source regions formed under the mesas. A top metal served as an anode is then formed on the resulted front surface connecting the MOS gates and the adjacent source regions.
申请公布号 US2014374790(A1) 申请公布日期 2014.12.25
申请号 US201414215224 申请日期 2014.03.17
申请人 Chip Integration Tech.Co., Ltd. 发明人 JIN QINHAI
分类号 H01L29/747 主分类号 H01L29/747
代理机构 代理人
主权项 1. A trench rectifier device, comprising: an n type lightly doped epitaxial layer on a heavily doped n type semiconductor substrate having a plurality of trenches formed in parallel therein and said trenches having a trench oxide layer formed on a bottom and sidewalls of said trenches; a first conductive poly-Si layer filled said trenches; a plurality of MOS gates having a stack of a second conductive poly-Si layer/a planar gate oxide layer formed on mesas in between said trenches; a plurality of source regions formed in said mesas; and a top metal layer formed over said MOS gates and said source regions.
地址 Zhubei City TW