发明名称 |
CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide conductive particles capable of enhancing conduction reliability when electrically connecting electrodes. ! SOLUTION: Conductive particles 1 according to the present invention each include a base material particle 2 and a conductive layer 3 disposed on the surface of the base material particle 2. The base material particle 2 has a compressive elastic modulus of 1,000 N/mm2 or more when compressed by 10%. The conductive layer 3 has a palladium layer on the outer surface side. The content of palladium is 99.9 wt.% or more in 100 wt.% of the palladium layer. ! COPYRIGHT: (C)2015,JPO&INPIT |
申请公布号 |
JP2014241278(A) |
申请公布日期 |
2014.12.25 |
申请号 |
JP20140098687 |
申请日期 |
2014.05.12 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
O GYOKA |
分类号 |
H01B5/00;H01B1/00;H01B1/22;H01R11/01 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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