发明名称 CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide conductive particles capable of enhancing conduction reliability when electrically connecting electrodes. ! SOLUTION: Conductive particles 1 according to the present invention each include a base material particle 2 and a conductive layer 3 disposed on the surface of the base material particle 2. The base material particle 2 has a compressive elastic modulus of 1,000 N/mm2 or more when compressed by 10%. The conductive layer 3 has a palladium layer on the outer surface side. The content of palladium is 99.9 wt.% or more in 100 wt.% of the palladium layer. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2014241278(A) 申请公布日期 2014.12.25
申请号 JP20140098687 申请日期 2014.05.12
申请人 SEKISUI CHEM CO LTD 发明人 O GYOKA
分类号 H01B5/00;H01B1/00;H01B1/22;H01R11/01 主分类号 H01B5/00
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