ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

摘要

A first metal film, of which major component is copper, is formed on a surface of a conductive portion which becomes a front surface electrode of a semiconductor element. A second metal film of which major component is silver is formed on a surface of the first metal film. A metal plate, which electrically connects the conductive portion and the other members (e.g. a circuit pattern of an insulated substrate) is bonded with a surface of the second metal film via a bonding layer containing silver particles. The second metal film does not contain nickel which decreases the bonding strength between the second metal film and the bonding layer containing silver particles. With the above configuration, an electronic component having a high bonding strength, excellent heat resistance and radiation performance, and a manufacturing method for the electronic component can be provided.

主权项

1. An electronic component, comprising:
a conductive portion which is disposed on a surface of a semiconductor element; a first metal film, which is disposed on a surface of the conductive portion, and is formed of a material of which major component is copper; a second metal film, which is disposed on a surface of the first metal film, and is formed of a material of which major component is a metal having a less ionization tendency than the first metal film; and a bonding layer, which is disposed on a surface of the second metal film, and contains silver particles.