| 摘要 |
PROBLEM TO BE SOLVED: To provide a temporary adhesive material which facilitates temporary adhesion of a wafer to a support member and also enables formation of a temporary adhesive layer having high uniformity in thickness on a substrate with a difference in surface height, has high process adaptability to TSV formation and wafer underside wiring, facilitates peeling off a thin wafer from the support member and improves productivity, and a temporary adhesive film and a method for manufacturing thin wafer using them.SOLUTION: The inventive temporary adhesive layer enables formation of a temporary adhesive layer even on a wafer having a difference in surface height, and because of the uniformity in thickness, allows a uniform thin wafer having a thickness of 50 μm or less to be obtained easily. Further, since it enables stress-free peeling off of a thin wafer from a support member after formation thereof with a little amount of exposure, fragile thin wafers can be easily handled without causing damage thereto, facilitating manufacture of a thin wafer. |
