| 发明名称 |
CIRCUIT ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Various embodiments may provide a circuit arrangement. The circuit arrangement may include a carrier having at least one electrically conductive line; a plurality of discrete encapsulated integrated circuits arranged on the carrier; wherein a first integrated circuit of the plurality of integrated circuits is in electrical contact with a second integrated circuit of the plurality of integrated circuits to form a first current path bypassing the carrier; and wherein the first integrated circuit of the plurality of integrated circuits is in electrical contact with the second integrated circuit of the plurality of integrated circuits to form a second current path via the at least one electrically conductive line. |
| 申请公布号 |
US2014374913(A1) |
申请公布日期 |
2014.12.25 |
| 申请号 |
US201313925900 |
申请日期 |
2013.06.25 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Otremba Ralf;Schiess Klaus;Mauder Anton |
| 分类号 |
H01L25/18;H01L25/00 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit arrangement, comprising:
a carrier comprising at least one electrically conductive line; a plurality of discrete encapsulated integrated circuits arranged on the carrier; wherein a first integrated circuit of the plurality of integrated circuits is in electrical contact with a second integrated circuit of the plurality of integrated circuits to form a first current path bypassing the carrier; and wherein the first integrated circuit of the plurality of integrated circuits is in electrical contact with the second integrated circuit of the plurality of integrated circuits to form a second current path via the at least one electrically conductive line. |
| 地址 |
Neubiberg DE |
